Taipei – Taiwan Semiconductor Manufacturing Co. confirmed on Thursday that it was looking into a radical new type of chip packaging technology for artificial intelligence, but warned that the output of AI chips would remain limited until 2025, longer than originally expected.
TSMC said its 2024 capital spending will be between $30 billion and $32 billion, the upper end of its forecast, to support advanced chip manufacturing and advanced packaging capacity, a sign of the chipmaker’s confidence that demand will remain strong.
